This chip is not supported yet (I'm adding it to TODO list on your request) but generaly winbond stacked devices are supported since v1.8.5, for example W25M512JV and larger you have in database [DIE0] and [DIE1]. For each such device below prescript with selecting DIE is executed before any operation.
Code: Select all
//W25M512JV Die0 Select
#SCRIPT HEADER;
SCRIPT:v1.8.5;
#HARDWARE SETTINGS;
HW:SPI,3.0V,SLOW;
#OPERATION;
SW:0,0,0,0,5,5,10,0,100,500;
INSTR:C2,00;
#LeaveVppEnabled
Code: Select all
//W25M512JV Die1 Select
#SCRIPT HEADER;
SCRIPT:v1.8.5;
#HARDWARE SETTINGS;
HW:SPI,3.0V,SLOW;
#OPERATION;
SW:0,0,0,0,5,5,10,0,100,500;
INSTR:C2,01;
#LeaveVppEnabled
You can execute above script before operating on the memory and it will work.
Please note that last operation is
#LeaveVppEnabledIt means that
voltage will be NOT disconnected after script execution so please be careful when you are operating on such device after script executed because you will have still voltage on outputs.
When you select DIE0 you can operate as standard W25Q16JV
When you select DIE1 you can operate as standard W25N01GV